Téléchargez le livre : Microelectronic Applications of Chemical Mechanical Planarization

Microelectronic Applications of Chemical Mechanical Planarization



de

Éditeur :

Wiley-Interscience


Paru le : 2007-12-04



eBook Téléchargement DRM Adobe 🛈
207,78 €
Téléchargement immédiat
Dès validation de votre commande
Ajouter à ma liste d'envies
Image Louise Reader présentation

Louise Reader

Lisez ce titre sur l'application Louise Reader.

badge apple Application Louise Reader
badge Android Application Louise Reader
Description
An authoritative, systematic, and comprehensive description of current CMP technology

Chemical Mechanical Planarization (CMP) provides the greatest degree of planarization of any known technique. The current standard for integrated circuit (IC) planarization, CMP is playing an increasingly important role in other related applications such as microelectromechanical systems (MEMS) and computer hard drive manufacturing. This reference focuses on the chemical aspects of the technology and includes contributions from the foremost experts on specific applications. After a detailed overview of the fundamentals and basic science of CMP, Microelectronic Applications of Chemical Mechanical Planarization:
*

Provides in-depth coverage of a wide range of state-of-the-art technologies and applications
*

Presents information on new designs, capabilities, and emerging technologies, including topics like CMP with nanomaterials and 3D chips
*

Discusses different types of CMP tools, pads for IC CMP, modeling, and the applicability of tribometrology to various aspects of CMP
*

Covers nanotopography, CMP performance and defect profiles, CMP waste treatment, and the chemistry and colloidal properties of the slurries used in CMP
*

Provides a perspective on the opportunities and challenges of the next fifteen years

Complete with case studies, this is a valuable, hands-on resource for professionals, including process engineers, equipment engineers, formulation chemists, IC manufacturers, and others. With systematic organization and questions at the end of each chapter to facilitate learning, it is an ideal introduction to CMP and an excellent text for students in advanced graduate courses that cover CMP or related semiconductor manufacturing processes.
Pages
760 pages
Collection
n.c
Parution
2007-12-04
Marque
Wiley-Interscience
EAN papier
9780471719199
EAN PDF
9780470180891
Informations sur l'ebook
Nombre pages copiables
0
Nombre pages imprimables
760
Taille du fichier
25467 Ko
Ce livre est accessible aux handicaps Voir les informations sur l'accessibilité
Prix
207,78 €

Suggestions personnalisées