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Description
Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance.
Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: Interconnect functions, characterisations, electrical properties and wiring requirements Low-k materials: fundamentals, advances and mechanical  properties Conductive layers and barriers Integration and reliability including mechanical reliability, electromigration and electrical breakdown New approaches including 3D, optical, wireless interchip, and carbon-based interconnects
Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips.
Pages
608 pages
Collection
n.c
Parution
2012-02-17
Marque
Wiley
EAN papier
9780470662540
EAN PDF
9781119963240
Informations sur l'ebook
Nombre pages copiables
0
Nombre pages imprimables
608
Taille du fichier
53330 Ko
Ce livre est accessible aux handicaps Voir les informations sur l'accessibilité
Prix
186,68 €
EAN EPUB
9781119966869
Informations sur l'ebook
Nombre pages copiables
0
Nombre pages imprimables
608
Taille du fichier
23552 Ko
Ce livre est accessible aux handicaps Voir les informations sur l'accessibilité
Prix
186,68 €

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